JPS62132783U - - Google Patents
Info
- Publication number
- JPS62132783U JPS62132783U JP2066886U JP2066886U JPS62132783U JP S62132783 U JPS62132783 U JP S62132783U JP 2066886 U JP2066886 U JP 2066886U JP 2066886 U JP2066886 U JP 2066886U JP S62132783 U JPS62132783 U JP S62132783U
- Authority
- JP
- Japan
- Prior art keywords
- needle
- resin
- syringe
- substrate
- die bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims 3
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2066886U JPS62132783U (en]) | 1986-02-13 | 1986-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2066886U JPS62132783U (en]) | 1986-02-13 | 1986-02-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62132783U true JPS62132783U (en]) | 1987-08-21 |
Family
ID=30816391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2066886U Pending JPS62132783U (en]) | 1986-02-13 | 1986-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62132783U (en]) |
-
1986
- 1986-02-13 JP JP2066886U patent/JPS62132783U/ja active Pending